铜表面硬脂酸自组装膜的制备及耐腐蚀性能

Preparation and corrosion resistance of self-assembled stearic acid monolayer on copper surface

应用自组装技术在Cu(OH)2纳米柱/CuO微花阶层结构表面制备硬脂酸自组装膜(SAM),运用电化学阻抗谱探讨了形成自组装膜的较佳浓度和自组装时间,通过极化曲线和循环伏安法考察了硬脂酸自组装膜在0.1mol/LNaCl溶液中对铜电极的缓蚀性能。结果表明,当CuO/Cu(OH)2电极在8mmol/L硬脂酸溶液中自组装24h时,得到的硬脂酸自组装膜能显著提高铜电极的耐蚀性;与裸铜电极相比,SAM-CuO/Cu(OH)2电极的腐蚀电流降低了2个数量级,缓蚀效率达到98.81%。

A stearic acid（STA） self-assembled monolayer（SAM） was prepared on the surface of Cu（OH） 2 nanowire/hierarchical CuO structure by self-assembly technology. The optimal STA concentration and self-assembly time for SAM formation were studied via electrochemical impedance spectroscopy. The corrosion inhibition performance of stearic acid self-assembled monolayer on copper electrode in a 0.1 mol/L NaCl solution was examined by polarization curve measurement and cyclic voltammetry. The results showed that the stearic acid self-assembled monolayer prepared on CuO/Cu（OH） 2 electrode by immersing it in a 8 mmol/L stearic acid solution for 24 h can remarkably improve the corrosion resistance of the copper electrode. Compared with the bare copper electrode,the SAM-CuO/Cu（OH） 2 electrode has a corrosion current density decreased by two orders of magnitude,and its inhibition efficiency is up to 98.81%.