基于ANSYS的芯片冷却器传热分析

Heat transfer analysis of a chip cooler based on ANSYS

针对微槽式芯片冷却器,建立三维仿真模型,分析其稳态工况下的传热情况,获得其温度和热应力分布。分析了五种不同结构形式芯片冷却器工作性能的影响,比较了纯铜和氮化硅复合物两种材质对散热性能的影响。结果表明,铜质冷却器散热性能较好,但内部热应力却高于复合材质冷却器。通过将原冷却通道分割成两个相同的小通道,可提高冷却性能,且应将小通道同向布置,这样不仅能降冷却器温度而且能降低应力。文中的工作对于今后的研发具有参考价值。

Aiming at a grooved micro chip cooler, a three dimensional simulation model was developed to study the heat transfer procedure of the cooler working under steady condition. The profiles of temperature and thermal stress were obtained. And the effect of different structures was analyzed by a comparison between five different physical models. Also two different materials, i.e. copper and silicon oxynitride compound, were introduced to investigate the effect of material on the performance of the cooler. The results indicate that the copper cooler has better cooling capacity though its internal stress is higher than that of a compound cooler. The performance of the cooler is improved by splitting an original channel cross - section into two identical smalls. The small channels should be arranged in the same direction so as to achieve not only a lower temperature but also a lower thermal stress. The efforts of this paper are referable for further study.