微电子封装点胶技术的研究进展

Advances in Fluid Dispensing Technology for Micro-electronics Packaging

流体点胶是一种以受控的方式对流体进行精确分配的过程,它是微电子封装行业的关键技术之一。目前,点胶技术逐渐由接触式点胶向无接触式(喷射)点胶技术转变。从微电子封装过程的应用出发,对点胶技术的发展进行了概述;在对比各种点胶方式的同时,重点介绍了无接触式喷射点胶技术,以及其中所涉及的关键技术,并提出了评价点胶品质的标准。

Fluid dispensing is a process to dispensing the fluid accurately in a controlled manner,it is one of the key technologies of microelectronics packaging. At present, there is an evolution in the fluid dispensing technology for applying fluids from contact methods to non-contact methods, such evolution will bring a great change for the dispensing industry. Based on the applications of dispensing technology in microelectronics packaging processes, dispensing technical development process was overviewed. Contrasting the features and performances of various methods, the non-contact jetting technology was mainly highlighted,including its key technologies and the evaluation standard of dispensing quality.