摘要
流体点胶是一种以受控的方式对流体进行精确分配的过程,它是微电子封装行业的关键技术之一。目前,点胶技术逐渐由接触式点胶向无接触式(喷射)点胶技术转变。从微电子封装过程的应用出发,对点胶技术的发展进行了概述;在对比各种点胶方式的同时,重点介绍了无接触式喷射点胶技术,以及其中所涉及的关键技术,并提出了评价点胶品质的标准。
Fluid dispensing is a process to dispensing the fluid accurately in a controlled manner,it is one of the key technologies of microelectronics packaging. At present, there is an evolution in the fluid dispensing technology for applying fluids from contact methods to non-contact methods, such evolution will bring a great change for the dispensing industry. Based on the applications of dispensing technology in microelectronics packaging processes, dispensing technical development process was overviewed. Contrasting the features and performances of various methods, the non-contact jetting technology was mainly highlighted,including its key technologies and the evaluation standard of dispensing quality.
出处
《中国机械工程》
EI
CAS
CSCD
北大核心
2011年第20期2513-2519,共7页
China Mechanical Engineering
基金
中央高校基本科研业务费专项资金资助项目(2010121039)
国家自然科学基金资助项目(51035002
50875222)
关键词
微电子封装
流体点胶
针头点胶
无接触式
喷射
micro- electronics packaging
tluid dispensing
needle dispensing
non- contact
j etting