电路板级互连焊点故障监测和预警

Fault Monitoring and Early Warning of Board Level Solder Joint Interconnection

针对互连焊点在长期应力作用下的蠕变失效,探讨了焊点阻值退化的一般性趋势,在此基础上提出了一种基于电阻电桥原理的焊点故障监测和预警电路设计方案,并基于电子产品可靠性保障工程应用,讨论了电路板级互连焊点故障监测和预警电路的实现路径的方法。嵌入式监测电路在电阻缓慢退化阶段和快速退化阶段设置合理的监测起始和终止点,适合对服役中的焊点健康状况进行实时监测和评估。同时,电路具有预警功能,在焊点电性能退化的初期发出预警,并实时采集焊点阻值数据用于焊点剩余寿命的预测,以实现焊点退化的及时预警和退化焊点剩余寿命的预计。

Focusing on the creep failure of solder joint due to long-term stress,the general degeneration process of solder joint was disc ussed,and on this basis a monitoring and warning circuit scheme according to r esistance bridge princi ple was proposed.In addition,based on reliable engineering application of ele c tronic product,the implementation method of this board-level circuit was also d iscussed.In this embedded monitoring circuit,starting and ending points were r easonably set both in slow and rapid degradation stages of the resistance,which was suited for the real-time monitoring and evaluating the operating state of solder joints in service.Meanwhile,the circuit has a monitori ng function,signaling a warning at the early stage of solder joint degradation. A nd it collected the real-time data of solder joint resistance for remaining lif e prediction,achieving both early warning and remaining life prediction.