9Hirogaki T, Aoyama E, Inoue H, et al. Laser drilling of blind via holes in aramid and glass/epoxy composites for multi - layer primed wiring boards[J]. Composites Part A, 2001,32:913 -968.
10Paul. L K. Stable UV competitions comprising triphehyl phosphite for foming solder mask coatings of high cure depth: US Patent,4614704[P]. 1986 - 09 - 23.