摘要
在铍青铜基体上采用镍作为中间层然后镀金是传统的镀覆方法。有些应用场合不允许采用镀镍而直接镀金,必须解决镀层与基体结合力的问题。分析铍青铜的特性和镀金层结合力不良的原因,提出了一种铍青铜直接电镀金的工艺流程和工艺参数,包括热处理疏松氧化层、微腐蚀、除钝化膜、镀金及封闭处理等工序,解决了铍青铜氧化层的去除及镀金层与基体结合力的问题,使产品质量稳定。
The traditional way of electroplating on beryllium bronze substrate use nickel coating as an intermediate layer before gold plating.In some cases,direct gold plating is needed,and the adhesion problem should be resolved.In this paper,the characteristics of beryllium bronze and affecting factor on adhesion were firstly discussed.And then a new gold plating technique on beryllium bronze including process and parameters of heat treatment loosening oxidation layer,micro corrosion,removal of passivation film,gold plating and sealing treatment was put forward.The problems on the removal of oxidation layer and adhesion between gold plating and substrate were resolved,and the gold plating had a stable performance.
出处
《电镀与精饰》
CAS
北大核心
2011年第10期36-37,共2页
Plating & Finishing
关键词
铍青铜
电镀金
封闭
beryllium bronze
gold electroplating
sealing