金基六元合金电接触材料的显微组织和性能研究

Microstructure and Mechanical Properties of Au-base Alloy Electrical Contact Materials

通过XRD、SEM、EDS等分析技术研究了铸态、加工态在不同热处理过程中,AuCuPtPdNiRh合金的显微组织及物相变化。结果表明,该金基六元合金主要由以AuCu为基的固溶体和PtRh为基的固溶体,以及两者的混合固溶体组成;经不同的热处理过程后,固溶体中的溶质原子含量发生变化。金基六元合金经过500℃、100 min的时效处理,抗拉强度可达1420 MPa。在85℃、50μA、DC 30 mV条件下,金基六元合金触头的寿命可达106次。

The microstructure and phases during thermal treatment of AuCuPtPdNiRh alloy was investigated by XRD,SEM and EDS.It was indicated that three types in the solution were found： the AuCu-based solid solution,PtRh-based solid solution and mixture of them.By different thermal treatments,the content of atom of solute in the solution was changed.The tensile strength of this Au-base alloy can be reached 1420 MPa by aging at 500℃ for 100 min.Under the condition of 85℃,50 μA and DC 30 mV,the life of Au-base alloy contact device was 106 times.