摘要
针对现代高性能嵌入式系统高速RapidIO信号接入的应用需求,提出一种基于可编程片上系统(SoPC)的前端RapidIO接口设计方案,以VirtexII Pro现场可编程门阵列芯片为核心,利用RapidIO IP核等库资源及硬件编程实现RapidIO接口、低压差分信号图像接口、RS422控制接口间的信息转发逻辑。该方案能够提高信息采集和输出的时效性。
With respect to the requirement of high speed RapidIO signal connection of high performance embedded system,this paper proposes a method for a front RapidIO interface on System-on-a-Programmable-Chip（SoPC）.The method builds message transmission logic among RapidIO interface,Low Voltage Differential Signal（LVDS） image interface and RS422 control interface with RapidIO IP core and hardware programming based on the development platform of Xilinx VirtexII Pro.Hardware architecture diagrams and key design thoughts are introduced and the software architecture is presented.
出处
《计算机工程》
CAS
CSCD
北大核心
2011年第20期239-241,245,共4页
Computer Engineering
关键词
嵌入式系统
可编程片上系统
RAPIDIO协议
低压差分信号
embedded system
System-on-a-Programmable-Chip（SoPC）
RapidIO protocol
Low Voltage Differential Signal（LVDS）
