涂膏式极板固化工艺的选择与探讨

The choosing and discussion of curing process of pasted plate

分析了铅蓄电池极板固化的机理及固化不良的危害,提出了极板固化参数和固化条件的选择与控制,并通过对固化过程的跟踪监测,更全面认识了每阶段的作用机理和变化规律,为固化工艺的研究和改进提供了支撑。

The mechanism of plate curing process and bad curing harm to plates were analyzed in this paper.The choosing and controling of the curing parameters and conditions were suggested.With keeping trace of the process of curing,the mechanism and changing law of each step of curing process were understood profoundly.This assisted the research and amelioration for the curing process of plate.