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Rheological Behaviors and Processing Windows of Low Viscosity Epoxy Resin for VIMP 被引量:2

Rheological Behaviors and Processing Windows of Low Viscosity Epoxy Resin for VIMP
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摘要 The chemorheological behaviors of a low viscosity epoxy resin system (Huntsman 1564/3486) for vacuum infusion moulding process (VIMP) were studied with viscosity experiments.The dual-Arrhenius rheological model and the engineering viscosity model were established and compared with the experimental data.The result showed that the viscosity in the earlier stage calculated by dual-Arrhenius model were smaller than the experimental data,while the data calculated by the engineering model were larger.Combining the two models together can predict the rheological behaviors of the resin system in a more credible manner.The processing windows of the resin system for VIMP were determined based on the two models.The optimum processing temperature is 30-45 ℃. The chemorheological behaviors of a low viscosity epoxy resin system (Huntsman 1564/3486) for vacuum infusion moulding process (VIMP) were studied with viscosity experiments.The dual-Arrhenius rheological model and the engineering viscosity model were established and compared with the experimental data.The result showed that the viscosity in the earlier stage calculated by dual-Arrhenius model were smaller than the experimental data,while the data calculated by the engineering model were larger.Combining the two models together can predict the rheological behaviors of the resin system in a more credible manner.The processing windows of the resin system for VIMP were determined based on the two models.The optimum processing temperature is 30-45 ℃.
作者 刘卓峰
出处 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2011年第5期931-934,共4页 武汉理工大学学报(材料科学英文版)
基金 Supported by the 863 National Project of China (No.2007AA03Z563) the Specialized Project of the HUNAN Province of China(No.2006GK1002)
关键词 vacuum infusion molding process(VIMP) epoxy resin rheological behaviors vacuum infusion molding process(VIMP) epoxy resin rheological behaviors
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