锗片的高速机械化学研磨工艺研究

The study of high speed mechanochemistry grinding technology for germanium wafer

利用机械化学研磨的原理对锗片进行高速研磨。以研磨压力、主轴转速、磨料成分和磨料粒度为影响材料的去除率和工件表面粗糙度的主要因素,进行对比性实验,通过实验分析研究确定了的锗片研磨加工工艺,加工后的锗片能够满足使用需要。

High-speed grinding on germanium wafer with the principle of chemical mechanical grinding.The main factors which affects the rate of material removal and surface roughness are grinding pressure,spindles speed,the composition of adhesive particle and particle size and aming at these main factors and some contrast experiments are maken.Experimental analysis determined the process of mechanochemistry grinding on germanium wafer.The optimized wafer can meet the use of products fully.