大型医疗设备芯片级维修探讨

Discussion on chip-level maintenance of large medical devices

目的:通过对大型医疗设备芯片级维修探讨,解决大型医疗设备维修费用高昂的突出问题。方法:研究医疗设备的芯片级维修的实质是研究透过故障现象追踪锁定有问题的芯片。详细阐述芯片级维修的具体要求以及分析芯片级维修的各种方法说明芯片级维修的可行性。结果:医疗设备的运行维护费用显著降低,采用芯片级的精细维修比直接更换模块板卡节约维修成本节约60%～90%。与厂家直接更换模块相比,板卡级维修只有其价格的10%至40%,几年下来为医院节约资金数百万元,效益明显。结论:对医疗设备的故障板卡进行芯片级维修是完全可行的,芯片级维修是将来医院设备科进行维修工作的可行且必由之路。

Objective：To solve the prominent problem of costly maintenance fees of sophisticated medical equipment and instruments in hospitals by exploring the probability of chip-level maintenance of the devices.Methods：The concrete requirements of the chip-level maintenance are stated and various ways of the maintenance were analyzed,by which the probability of the maintenance was described.Results：The maintenance or repairing fees could be reduced much more prominently by chip-level repairing than by replacing circuit boards or cards directly,that is,decreasing maintenance cost by 60% to 90%.Conclusion：It will be a trend towards chip-level repairing for hospitals.