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基于LTCC技术频率源的设计与实现 被引量:2

Miniaturization Frequency Synthesizer Based on LTCC Technology Research and Implementation
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摘要 基于LTCC技术,设计制作了一款小型化频率源。该频率源采用单环锁相电路实现,并将输出滤波器集成在LTCC基板内,实现了电路的小型化,锁相环电路板面积仅为20 mm×20 mm。同时给出了该频率源的组装及调试过程,经测试,该频率源输出频率为12.5~13.5GHz,相噪为-80 dBc/Hz@1kHz。 A miniaturization Frequency Synthesizer has been designed and fabricated using Low-temperature Co-fired Ceramic (LTCC) technology. The Frequency Synthesizer adopts monocyc!ie phase locked circuit, and output filter can integrate inside the substrate. It can realize the goal of miniaturization. The area of this frequency synthesizer is only 20ram x 20ram through proper arrangement. It also gives the process of Frequency Synthesizer assembly and adjustment. The output frequency is from 12. 5GHz to 13.5GHz, phase noise is - 80dBc/Hz@ 1 kHz.
作者 王玉军 孙旭
出处 《实验科学与技术》 2011年第5期26-28,共3页 Experiment Science and Technology
关键词 低温共烧陶瓷 滤波器 小型化 频率源 low-temperature co-fired ceramic filter miniaturization frequency synthesizer
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参考文献5

  • 1严伟,禹胜林,房迅雷.基于LTCC技术的三维集成微波组件[J].电子学报,2005,33(11):2009-2012. 被引量:37
  • 2Dean Banerjee. PLL Performance. Simulation and Design [ M]. USA: USA National Semiconductor, 1998.
  • 3Alex Beiley et al. Miniature Filter for Digital Receiver[ J ]. IEEE MTT-S Digest Part, 1992 (2) : 999 - 1002.
  • 4方立军,马骏,王元庆.现代频率合成中的分数分频与锁频环[J].现代雷达,2002,24(3):68-72. 被引量:7
  • 5Schmiickle F J, Jentzsch A, Heinrich W, et al. LTCC as MCM Substrate: Design of Strip-Line Structures and Flip- Chip Interconnects[J]. IEEE MTT-S, 2001 (8) : 1903 - 1906.

二级参考文献12

  • 1A Contolatis,V Sokolov.90°RF vertical interconnects[J].Microwave Jour nal,1993,36(6):102-104.
  • 2Yan Wei,Fang Xunlei,Yu Shenglin,Fu Peng.High density packaging technologies for 3D integrated phased-array microwave modules[A].2004 Inter national Radar Conference(RADAR2004)[C].Toulouse,France,2004.
  • 3A lsarawi S F,Abbott D,Franzon P D A.Review of 3D packaging technology[J].IEEE Tran.On CPMT,Part B,1998,21(1):2-14.
  • 4F J Schmuckle,A Jentzsch,W Heinrich,et al.LTCC as MCM substrate:design of strip-line structure and flip-chip interconnects[A].2001 IEEE MTT-S Digest[C].Phoenix,USA,2001.1903-1906.
  • 5Dear nely,R W,A R F Barel.A broad-band transmission line model for a rectangular microstrip antenna[J].IEEE Trans.AP,1989,37(1):6-15.
  • 6Yan Wei,Fang Xunlei,Hong Wei.3D packaging & interconnecting techniques for microwave modules[A].6th Inter national Symposium on Antenna,Propagation,and EM Theory (ISAPE2003)[C].Beijing,China,2003.847-850.
  • 7Mark S Hauhe,John J Wooldridge.High density packaging of X-band active array modules[J].IEEE Trans.on CPMT,Part B.1997,20(3):279-291.
  • 8P Monfraix,P Ulian,C Drevon,et al.3D microwave modules for space applications[A].Proceedings of 1998 IEEE MTT-S Digest[C].Maryland,USA,1998.1289-1292.
  • 9周井泉,程景清.基于ΣΔ调制的频率合成器及其性能[J].南京邮电学院学报,1997,17(3):107-111. 被引量:13
  • 10方立军,徐光争,马骏.低相噪数字锁相间接频率合成器的研究[J].现代雷达,2000,22(5):77-82. 被引量:17

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