摘要
研究了SBS-g-AA阳膜表面无钯活化的化学镀镍方法,化学镀镍条件:活化时间为20～30min,还原时间为15～25min,施镀时间20～30min.SEM图说明Ni原子以球状微粒沉积于SBS-g-AA阳膜表面.
In this paper the method of electroless nickel plating on the SBS-g-AA without using palladium salt was studied. The conditions of electroless nickel plating are：20-30 min of activation time, 15-25 min of reduction time, 20-30 min of plating time. The SEM image shows that the nickel atiom can be deposited on the SBS-g-AA as spherical particles by this mthod.
出处
《厦门大学学报（自然科学版）》
CAS
CSCD
北大核心
2011年第B09期87-90,共4页
Journal of Xiamen University：Natural Science
基金
福建省自然科学基金项目(2010J01028)
福建师范大学本科生课外科技计划项目(BKL2010-041)
关键词
SBS-g-AA阳膜
化学镀镍
活化
还原
SBS-g-AA cation exchange membrane
electroless nickel plating
activation
reduction
