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SAVER在现代包装物流中的应用 被引量:2

Application of SAVER in Modern Packaging Logistics
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摘要 SAVER的主要型号有SAVERTM3X90,SAVERTM9X30,SAVERTM3M30。其系列产品可跟踪记录真实运输中跌落、冲击、振动、气压、温湿度等环境数据,利用分析软件对采集到的数据进行分析处理,可判断出环境中存在的对包装有害的因素及危害程度,并以此为依据改善包装,优化产品结构设计;还可监控产品的物流环境,以改善运输环境;同时,利用SAVER采集的数据可制定和完善产品运输测试标准。 The main models of SAVER include SAVERTM3X90, SAVERTM9X30, SAVERTM3M30. These products can trace and record the environmental data, such as drop, shock, vibration, pressure, humiture, and so on in the real transportation. With the incidental software to analyze and process the collected data, the harmful factors in packaging environment and degree of harm can be estimated as a basis to improve the product or packaging, and so as to optimize the structural design of the product itself. These products can also monitor the logistics environment of products in order to improve transportation environment. Using the data collected by SAVER the transportation test standard of products can also be built and improved.
出处 《包装学报》 2011年第4期19-22,共4页 Packaging Journal
基金 包装行业高新技术研发资金资助项目(湘财企指[2008]155号)
关键词 SAVER 包装物流 物流环境 运输测试标准 SAVER packaging logistics logistics environment transportation test standard
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参考文献9

  • 1GilmoreEvelyn.MeasurementandAnalysisoftheDistributionEnvironment[EB/OL].[2011-06-10].http://packaging.hp.com/misc/Presentation.
  • 2[Anon].SAVERTMFieldDataRecorders[EB/OL].[2011-05-02].http://www.lansmont.com/Instruments/Default.htm.
  • 3[Anon].SaverXwareTMFieldDataAnalysisSoftware[EB/OL].[2011-05-02].http://www.lansmont.com/Instru-ments/SaverXware/Default.htm.
  • 4孟宪文,计宏伟,王怀文,高晓鹏.PC主机运输包装件的防振缓冲性能评价[J].振动与冲击,2007,26(8):162-164. 被引量:9
  • 5SheehanRichardL.MeasurementandAnalysisoftheDistributionEnvironment[EB/OL].[2011-06-10].http://packaging.hp.com/made/FinalReport/made_study.htm.
  • 6sheehanRichardL.AnalysisofDropHeightData[EB/OL].[2011-06-10].http://www.ista.org.
  • 7Singh S P,Joneson E,Singh J,at al. Dynamic Analysis of Less-Than-Truckload Shipments and Test Methods to Simulate this Environment[J]. Packaging Technology and Science,2008,21(8) :453-456.
  • 8Chonhenchob V,Singh S P,Singh J J, et al. Measurement and Analysis of Truck and Rail Vibration Levels in Thailand[J]. Packaging Technology and Science,2010,23(2) :91-100.
  • 9Jarimopas B,Singh S P,Saengnil W. Measurement and Analysis of Truck Transport Vibration Levels in Thailand and Damageto Packaged Tangerines during Transit[J]. Packaging Technology and Science,2005,18(4) :179-188.

二级参考文献6

  • 1Tong Yan Tee,Hun Shen Ng.Impact life prediction modeling of TFBGA packages under board level drop test[J].Microelectronics Reliability,2004,44:1131-1142.
  • 2Desmond Y R,Chong F X Che.Drop impact reliability testing for lead-free and lead-based soldered IC packages[J].Microelectronics Reliability,2006,46:1160-1171.
  • 3Jeong-Wook Yi,Gyung-Jin Park.Development of a design system for EPS cushioning package of a monitor using axiomatic design[J].Advances in Engineering Software,2005,36:273-284.
  • 4Low K H,Wang Yuqi,Hoon K H.A virtual boundary model for a quick drop-impact analysis of electronic components in TV model[J].Advances in Engineering Software,2004,35:537-551.
  • 5贡晓婷,王志伟.双曲正切包装系统在后峰锯齿脉冲作用下的冲击特性[J].振动与冲击,2000,19(1):43-45. 被引量:8
  • 6许文才,向明.连续冲击载荷对包装产品的影响[J].振动与冲击,2001,20(3):26-28. 被引量:18

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