期刊文献+

通孔泡沫金属传热性能研究进展 被引量:7

The Current Research Status on Heat Transfer Performance of Metal Foams
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摘要 泡沫金属是一种新型功能材料,具有比重小、比表面积大等特点,尤其是开孔泡沫金属是一种优良的热交换材料,在工程中具有广阔的应用前景。本文简单介绍了开孔泡沫金属的传热性能表征及分析方法,介绍传热性能的一些影响因素。最后介绍了泡沫金属在散热器上的初步应用。 Foam metal is a kind of new functional materials with low specific gravity, high spicific surface etc.characteristics.Foam metal with open structures,a good heat exchanging materials,has wide application prospects in engineering.This paper briefly introduced the open foam metal heat transfer performance characterization and analyzing method,and some influencing factors. Finally, the preliminary application in the field of radiator was introduced.
出处 《铸造设备与工艺》 2011年第5期42-44,共3页 Foundry Equipment & Technology
基金 山西省回国留学人员科技项目(20111030)
关键词 泡沫金属 传热 散热器 foam metal, heat transfer, radiator
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参考文献8

  • 1卢天健,何德坪,陈常青,赵长颖,方岱宁,王晓林.超轻多孔金属材料的多功能特性及应用[J].力学进展,2006,36(4):517-535. 被引量:247
  • 2C. Y. Zhao,T. Kim,T. J. Lu,and H. P. Hodson.Thermal transport in high porosity cellular metal foams[J ]. JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER Vol.18,No. 3, July-September 2004.
  • 3Tuckerman D B,R. F. W. Pease. High-Performance Heat Sinking for VLSI IEEE electron device letters [J ], 1981, EDL-2 (5) : 126-129.
  • 4宋锦柱,何思渊.多孔泡沫铝的传热性能[J].江苏冶金,2008,36(2):28-30. 被引量:6
  • 5屈治国,徐治国,陶文铨,卢天健.通孔金属泡沫中的空气自然对流传热实验研究[J].西安交通大学学报,2009,43(1):1-4. 被引量:17
  • 6Kim S Y, Pack J W, Kang B H. Flow and heat transfer correlations for porous fm in a plate-fin heat exchanger [J]. Journal of Heat Transfer, 2000,122: 572-578.
  • 7Lee Y C, Zhang W, Xie H, Mahajan R L. Cooling of a chip package with 100W/cm2 chip [ C ]. New York: Proceedings of ASME International.
  • 8徐梦欣.泡沫镁合金的制备与性能研究[D].太原:太原科技大学,2009.

二级参考文献26

  • 1YANG Donghui,HE Deping,YANG Shangrun.Thermal decomposition kinetics of titanium hydride and Al alloy melt foaming process[J].Science China Chemistry,2004,47(6):512-520. 被引量:12
  • 2王二恒,虞吉林,王飞,孙亮.泡沫铝材料准静态本构关系的理论和实验研究[J].力学学报,2004,36(6):673-679. 被引量:20
  • 3戴戈,何德坪,尚金堂.铝合金熔体泡沫化过程中粘度的变化[J].材料研究学报,2005,19(1):35-41. 被引量:12
  • 4何德坪,闻德荪,张勇,舒光冀.铝熔体在多孔介质中的渗流过程[J].材料研究学报,1997,11(2):113-119. 被引量:17
  • 5BOOMSMA K, POULIKAKOS D, ZWICK F. Metal foams as compact high performance heat exchangers[J]. Mechanics of Materials, 2003,35:1161-1176.
  • 6TADRIST L, MISCEVIC M, RAHLI O, et al. About the use of fibrous materials in compact heat exchangers [J]. Experimental Thermal and Fluid Science, 2004, 28: 193-199.
  • 7KUMAR A, REDDY R G. Materials and design development for bipolar/end plates in fuel cells[J]. Journal of Power Sources,2004, 129: 62-67.
  • 8Kim SY, PAEK J W, KANG B H. Flow and heat transfer correlations for porous fin in a plate-fin heat exchanger[J]. J of Heat Transfer, 2000, 122: 572- 578.
  • 9CALMIDI V V, MAHAJAN R L. Forced convection in high porosity metal foams[J]. J of Heat Transfer, 2000, 122: 557-565.
  • 10ZHAOCY, I.UTJ, Hodson H P, et al. The temperature dependence of effective thermal conductivity of open-celled steel alloy foams[J]. Materials Science and Engineering: A, 2004, 367 (1/2): 123-131.

共引文献262

同被引文献74

  • 1李化,李黔东.紧凑式工业换热器传热试验平台设计与应用[J].化工生产与技术,2005,12(4):35-39. 被引量:1
  • 2邱海平,施明恒.泡沫铝翅片传热和流动特性的实验研究[J].工程热物理学报,2005,26(6):1016-1018. 被引量:17
  • 3徐梦欣.泡沫镁合金的制备与性能研究[D].太原:太原科技大学,2009.
  • 4Hwang S W,Jung H H,Hyun S Het al.Effective preparation of crack-free silica aerogels via ambient drying [J].JSol-Gel Sci Techn,2007(41 ) : 139.
  • 5Davies GJ,Zhen S.Metallic foam:their production,properties and applications.J Mat Sci[J], 1983,18:1899-1911.
  • 6Luo X B, Liu S. A micmjet array cooling system for thermal management of high--brightness LEDs [J]. IEEE Transactions on Advanced Packaging, 2007, 30(3): 475 - 484.
  • 7Arik M, Utturkar Y, Weaver S. Immersion Cooling of Light Emitting Diodes[C]. 12th IEEE Intersoeiety Conference on Thermal and Thermomeehanieal Phenomena in Electronic Systems. Las Vegas, N, United states.2010 : 1- 8.
  • 8Chau S W, Lin C H, YEH C H, et al. Study on the cooling enhancement of LED heat sources via an electrohydrodynamic approach[C]. The 33th Annual Con- ferenee of the 1EEE Industrial Electronics Society, 2007: 2934 - 2937.
  • 9Kim S Y, Pack J W, Kang B H. Flow and heat transfer cor- relations for porous fm in a plate-fin heat exchanger [J]. Journal of Heat Transfer, 2000, 122 : 572 - 578.
  • 10Lee Y C, Zhang W, Xie H, Mahajan R L. CooLing of a chip package with 100W/cm2 chip[C]. New York : Proceeding of ASME International.

引证文献7

二级引证文献25

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