框架有效成本与内引线长度技术能力的关系

Introduction on the Relationship between the Efficient Lead Frame Cost and Lead Post Length Technologies

引线框架封装和基板封装是集成电路封装两个基本结构类别,在当前的半导体封装产业中,引线框架封装依然占据了主导地位。近年来随着有色金属价格的飞涨,对框架类产品造成了严峻的成本挑战,而通过技术手段来降低产品有效成本才是最安全、可行的方向。文章通过对框架内引线长度技术能力的差异比较,在金丝价格飞涨的情况下,发现其对框架有效成本的影响非常显著,所以大家在选择高腿数新框架时不仅需要比较框架价格,更要关注内引线长度的技术能力,以达到最低的框架有效成本。

IC packages consist of two basic structure types, lead frame packages and substrate packages. Lead frame packages still hold dominant position in the present semiconductor industry, but the cost of the lead frame packages is facing great challenges due to a sky rocketing price of the nonferrous metal in recent years. An efficient cost reduction through technical means is the most safe and feasible direction. In this thesis, under the circumstances of the rise in gold wire price, with comparison of the differences between lead post length technologies, which we discover that has an obvious effect on the efficient cost of the lead frame. That is to say, not only should we compare the prices but also should pay more attention to the lead post length technologies on the new multi-lead frames selections to achieve the lowest efficient lead frame cost.