密封电子设备的热设计分析

Thermal Design Analysis on Sealed Electronic Equipment

随着电子设备热流密度的提升,其散热设计越来越重要。文中根据某工程设备,对其热设计展开分析。首先,依照设备技术指标和环境参数,通过相关计算确定了整机散热方式;然后采用了合理布局机箱内热源、合理布局电路板上高热组件、对高热组件加装散热片和热管、机箱内安装风扇等方法,从而完成了对高热组件进行温度控制的设计目标。

As the increase of density of heat flow, the thermal design of electronic equipment is getting more and more important. This paper takes an engineering device as exarnple to analyze the thermal design. First, this paper determines the top design specification after related calculations based on the equipment technique specifications and the environment parameters. Then, the techniques are used, such as rational distribution of heat within chassis, rational distribution of hot modules on the circuit board, adding heat sinks and heat pipes to hot components,fans installation in case, etc. By grace to techniques described in the paper, the design objective of temperature control of the hot components has achieved.