摘要
阐述了光电元件上盘和保护用胶粘剂的一般技术要求。重点介绍了光电元件加工过程中常用的无机胶粘剂、热熔胶、EP(环氧树脂)胶粘剂、压敏胶保护膜、瞬间胶、硅橡胶及UV(紫外光)固化胶的技术特点及其在光电元件上盘和保护过程中的应用,并对其发展趋势进行了展望。
The general technical requirements of adhesives ,which were used for fixation or protection of photoelectric element,were expounded. The technical characteristic of some common adhesives[such as inorganic adhesives, HMR （hot melt adhesives）, EP （epoxy resin） adhesives, PSA （pressure sensitive adhesive） for surface- protection, instantaneous curing adhesives ,silicone rubber adhesives, UV （ultraviolet）-curable adhesives and other adhesives] in process of machining photoelectric element and application in fixation or protection of photoelectric element were introduced. And the development trends for these adhesives were expected.
出处
《中国胶粘剂》
CAS
北大核心
2011年第10期54-57,共4页
China Adhesives
基金
科技部科技型中小企业技术创新基金项目(09C26215302509)
云南省科技计划项目(2009GA019)
关键词
胶粘剂
光电元件
加工
adhesive
photoelectric element
process
