摘要
在钎焊和时效条件下,研究了Sn-3.5Ag无铅钎料中添加0.2%的Zn元素后对钎料/铜界面组织形貌的影响.结果表明,钎焊条件下,将0.2%的Zn元素加入到Sn-3.5Ag钎料中对Cu-Sn间的金属间化合物及其扇贝形形状不产生影响.时效处理后,0.2%Zn元素的加入对界面IMC层的厚度、组成及形态都有影响.在Sn-3.5Ag-0.2Zn/Cu接头中,IMC层的长大得到了明显的抑制,并且与Sn-3.5Ag/Cu接头相比,IMCCu3Sn层的形成完全得到了抑制.在无锌的接头中,还观察到了IMC形态由扇贝形向层状转变,而在含锌的接头中,扇贝形组织在时效过程中没有发生变化.微量Zn元素的加入对IMC层的增长和组织形态的改变取决于IMC层内元素之间的相互扩散.
0.2% Zn element was added into Sn-3.5Ag Pb-free solder,and the interfacial microstructure at solder/Cu has been studied under as-soldered and as-aged condition.During soldering,the Cu-Sn intermetallic and its scallop-type structure are not changed by the small amount addition of Zn.However,in the Zn-contained solder joint,the scallops are found to be smaller but more compared with Zn-free solder joint.After thermal aging,the growth thickness,compositions and morphology of the IMCs at the interface are affected by the 0.2% Zn addition.In the Sn-3.5Ag-0.2Zn/Cu joints,the growth of IMC layer is evidently retarded and the Cu3Sn IMC layer is completely inhibited.Furthermore,compared with the change from scallop-type to flaky-type morphology observed in Zn-free solder joints,scallop-type structure is still the predominant morphology in Zn-contained solder joints during solid-state aging.The inhibitation of small amount of Zn addition on the IMC growth and change of morphology is attributed to the retarding effect of interdiffusion coefficient of the IMCs.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2011年第10期57-60,116,共4页
Transactions of The China Welding Institution
基金
江苏省高校自然科学研究面上项目(11KJB460003)
江苏高校优势学科建设工程资助项目
