基于叶序仿生抛光垫化学机械抛光温度的研究与分析

Temperature Research and Analysis on Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotasis Pattern

为了解决在化学机械抛光过程中抛光温度分布不均匀问题,使用叶序仿生抛光垫进行研究,并建立了抛光温度场模型。利用有限元分析软件ANSYS,对抛光温度场进行了仿真分析,获得了抛光垫的叶序参量对抛光温度分布的影响规律。通过对仿真结果进行分析发现,合理选择仿生抛光垫的叶序参数,能够使抛光温度变得更均匀。

In order to make the problems that the polishing temperature distribution of polishing more uniform during the chemical mechanical polishing（CMP）, did the research by using the bionic polishing pad with phyllotasis pattern, and the polishing temperature model of chemical mechanical polishing has been established. Using the ANSYS software of finite element analysis, the polishing temperature was simulated, and the effects of the phyllotaetic parameters of polishing pad on the polishing temperature distribution were analyzed. The results showed that the uniformity of the polishing temperature can be improved when the reasonable phyllotactic parameters of the polishing pad with phyllotasis pattern are selected.