期刊文献+

便于真空脱泡的高折光率LED封装用硅橡胶的研制 被引量:7

Synthesis a high refractive index silicone rubber easy de-bubbled through pressure reduction for LED encapsulant
下载PDF
导出
摘要 在加成型LED封装材料硫化过程中,需要经真空脱泡。在用甲基苯基环硅氧烷(DnMe,Ph)与四甲基环四硅氧烷D4H开环共聚合,乙烯基双封头作封端剂,制备乙烯基硅油过程中,向原料中添加适量三氟丙基环三硅氧烷,实现了向聚合物分子链中引入三氟丙基硅氧链节,降低了聚合物的表面张力,达到便于真空脱泡的目的。 A kind of transparent and colorless methylphenylhydrosilicone fluid with high refractive index serving as liquid cross-linking agent for Light Emitting Diode(LED) package was prepared by ring-opening copolymerization of methylhy drogencyclosiloxane and methylphenylcyclosiloxane catalyzed by cation exchange resin.De-bubbling through pressure reduction need to be adopted during the vulcanization of addition silicone for LED encausulant materials.In order to de-bubbling through pressure reduction easily,appropriate amount of 1,3,5-trimethyl-1,3,5-tris(3,3,3-trifluoropropyl) cyclotrisiloxane was added into the monomer mixtures of methylphenylcyclosiloxane,octamethyl cyclotetrasiloxane and tetramethyltetravinyl cyclotetrasiloxane to lower the surface tension of the products.The silicone rubber produced for LED package with the silicone fluids can de-bubble through pressure reduction easily.
出处 《化工新型材料》 CAS CSCD 北大核心 2011年第10期115-118,共4页 New Chemical Materials
基金 浙江省自然科学基金(Y4080264) 浙江省科技计划项目(2009C31081) 杭州师大成果转化与产学研结合项目(2010CXY9103) 浙江省新苗计划项目(ZX10035066)
关键词 LED 甲基苯基含氢硅油 脱泡 表面张力 light emitting diode(LED) methylphenylhydrosilicone fluid de-bubbling through pressure reduction surface tension
  • 相关文献

参考文献2

二级参考文献62

  • 1王晓明,郭伟玲,高国,沈光地.LED——新一代照明光源[J].现代显示,2005(7):15-19. 被引量:54
  • 2李林楷.电子封装用环氧树脂的研究进展[J].国外塑料,2005,23(9):41-43. 被引量:27
  • 3李元庆,杨果,杨洋,付绍云.氧化锌/环氧纳米复合材料的制备及其光学性能研究[J].功能材料与器件学报,2006,12(5):366-370. 被引量:6
  • 4付绍云,李元庆,杨果,等.一种抗紫外环氧组合物及其用途:CN,1858112A[P].2006-11-08.
  • 5HUANG J C, CHU Y P, WEI M, et al. Comparison of epoxy resins for applications in light-emitting diodes[J].Adv Polym Tech, 2004, 23 (4): 298-306.
  • 6HAITKO D A, RUBINSZTAJN, S. Phenyl-containing silicone epoxy formulations useful as encapsulants for LED applications: US, 0299165[P]. 2007-12-27
  • 7KODAMA K, KASHIWAGI T. Primer composition and electric/electronic component using the same: JP, 241407[P]. 2006-04-09.
  • 8HAITKO D A, SCHENECTADY N Y, RUBINSZTAJN S, et al. Silicone epoxy formulations: US, 0282975[P]. 2005-12-22.
  • 9HAITKO D A, BUCKLEY D. Silicone epoxy formulations: US, 0282976[P]. 2005-12-22.
  • 10ITO H, OTA S. Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same: US, 7307286 [P]. 2007-12-11.

共引文献53

同被引文献629

引证文献7

二级引证文献32

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部