摘要
在加成型LED封装材料硫化过程中,需要经真空脱泡。在用甲基苯基环硅氧烷(DnMe,Ph)与四甲基环四硅氧烷D4H开环共聚合,乙烯基双封头作封端剂,制备乙烯基硅油过程中,向原料中添加适量三氟丙基环三硅氧烷,实现了向聚合物分子链中引入三氟丙基硅氧链节,降低了聚合物的表面张力,达到便于真空脱泡的目的。
A kind of transparent and colorless methylphenylhydrosilicone fluid with high refractive index serving as liquid cross-linking agent for Light Emitting Diode(LED) package was prepared by ring-opening copolymerization of methylhy drogencyclosiloxane and methylphenylcyclosiloxane catalyzed by cation exchange resin.De-bubbling through pressure reduction need to be adopted during the vulcanization of addition silicone for LED encausulant materials.In order to de-bubbling through pressure reduction easily,appropriate amount of 1,3,5-trimethyl-1,3,5-tris(3,3,3-trifluoropropyl) cyclotrisiloxane was added into the monomer mixtures of methylphenylcyclosiloxane,octamethyl cyclotetrasiloxane and tetramethyltetravinyl cyclotetrasiloxane to lower the surface tension of the products.The silicone rubber produced for LED package with the silicone fluids can de-bubble through pressure reduction easily.
出处
《化工新型材料》
CAS
CSCD
北大核心
2011年第10期115-118,共4页
New Chemical Materials
基金
浙江省自然科学基金(Y4080264)
浙江省科技计划项目(2009C31081)
杭州师大成果转化与产学研结合项目(2010CXY9103)
浙江省新苗计划项目(ZX10035066)
关键词
LED
甲基苯基含氢硅油
脱泡
表面张力
light emitting diode(LED)
methylphenylhydrosilicone fluid
de-bubbling through pressure reduction
surface tension