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无卤无磷阻燃覆铜板基板材料的研究 被引量:2

Research on Halogen-free and Phosphorus-free Flame Retardant Base Material for CCL
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摘要 将自制的含氮苯并噁嗪树脂与E-51环氧树脂共混,以共混树脂体系作为基体树脂浸渍玻璃纤维布,制成了一种新型无卤无磷阻燃覆铜板基板材料,分析了不同含量E-51环氧树脂对板材的电性能、弯曲强度、极限氧指数和热稳定性的影响,结果表明:E-51的加入能够提高板材的电性能、弯曲强度、热稳定性,但降低了板材的极限氧指数;当E-51含量为65%时,所得的浸渍胶液具有较好的储存稳定性。 Using homemade-benzoxazine mixed with E-51 epoxy as matrix resin,a kind of novel halogen-free and phosphorous-free flame retardant base material was prepared by impregnating glass cloth.The effects of various contents of E-51 epoxy resin on the electrical properties,flexural strength,limit oxygen index and thermal stability of the base material were studied.The results show that the addition of E-51 can increase the electrical properties,flexural strength and thermal stability of the material,but decrease the limit oxygen index.When the E-51 content is 65%,the impregnating resin shows excellent storage stability.
出处 《绝缘材料》 CAS 北大核心 2011年第5期5-7,16,共4页 Insulating Materials
关键词 苯并口恶嗪树脂 覆铜板 无卤无磷阻燃剂 环氧树脂 benzoxazine copper clad laminate(CCL) halogen-free and phosphorus-free flame retardant epoxy resin
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参考文献7

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二级参考文献8

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同被引文献45

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