期刊文献+

低热机械噪声MEMS加速度计设计 被引量:4

Design of low thermal-mechanical noise MEMS accelerometer
下载PDF
导出
摘要 介绍了一种能够在大气条件下具备低噪声、高灵敏度特性的MEMS加速度计设计、制作与测试。器件采用梳齿电容检测方法,利用MEMS体硅加工工艺,实现了210对梳齿的加速度计制作。该加速度计不需要真空封装和阻尼孔就能实现低热机械噪声特性,其理论热机械噪声为0.018μg/槡Hz。加速度计芯片在大气封装和无阻尼孔情况下Q值高达455.06,与理论分析结果相符,具有较低的热机械噪声。 The design, manufacture and test results of a MEMS accelerometer with low thermal-mechanical noise and high sensitivity is presented. This acceleration sensor is based on comb finger capacitance testing and realized by bulk silicon process. There are 210 pairs of comb finger in the acceleration sensor. This sensor does not need vacuum package to achieve low thermal-mechanical noise. The theoretic value of thermal-mechanical noise is 0. 018 μg/Hz. The test result shows that the Q factor achieves 455.06 in atmosphere package and without damping holes, which matches the analysis result in theory.
出处 《传感器与微系统》 CSCD 北大核心 2011年第11期89-91,95,共4页 Transducer and Microsystem Technologies
关键词 加速度计 热机械噪声 体硅工艺 梳齿电容 滑膜阻尼 accelerometer thermal-mechanical noise bulk silicon process comb finger capacitance slide damping
  • 相关文献

参考文献4

二级参考文献26

  • 1冯宇翔.梳齿式微机械加速度计的电路改良及工程化研究[D].[硕士学位论文].北京:清华大学精仪系,2004.
  • 2[1]Yazdi N,Ayazi F,Najafi K.Micromachined inertial sensors[J].Proc IEEE,1998,86:164021659.
  • 3[2]Bao Min-Hang.Micro mechanical Transducers:Pressure sensors,Accelerometers and Gyroscopes[M].Amsterdam:Elsevier,2000:281-285.
  • 4[3]Chau K,Lewis S R,Zhao Y,et al.An integrated force balanced capacitive accelerometer for low-g applications[J].Sensors and Actuators A:Physical,1996,54 (1/2/3):472-476.
  • 5[4]Suminto J.A wide frequency range,rugged silicon micro accelerometer with over range stops[C] //9th IEEE Int Workshop on Micro Electro Mechanical Systems.San Diego,CA,1996:180-185.
  • 6[5]Huang Shusen,Li Xinxin,Wang Yuelin,et al.A piezoresistive accelerometer with axially stressed tiny beams for both much increased sensitivity and much broadened frequency bandwidth[C]//The 12th International Conference on Solid State Sensors,Actuators and Microsystems.Boston:IEEE.2003:91-94.
  • 7[6]Tschan T,de Rooij N,Bezinge A,et al.Characterizalion and modelling of silicon piezoresistive accelerometers fabricated by a bipolar-compatible process[J] Sensots and Actuators A:Physical,1991,27(1/2/3):605-609.
  • 8[7]Sim J H,Kim D K,Bae Y H,et al.Six-beam piezoresistive accelerometer with self-cancelling cross-axis sensitivity[J].Electron Lett,1998,34(5):497-506.
  • 9[8]Amarsinghe R,Dao D V,Toriyama T,et al.Design and fabrication of miniaturized six-degree of freedom piezoresistive Accelerometer[C]//MEMS 2005 18th IEEE International Conference.Florida,USA,2005:351-354.
  • 10[9]Plaza J A,Dominguez C,Esteve J,et al.BESOI-based integrated optical silicon accelerometer[J].J Microelectromech Syst,2004,13(2):355-364.

共引文献35

同被引文献21

引证文献4

二级引证文献8

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部