晶圆级封装的凸点印刷

Salient Point Printing for Silicon Wafer Packaging

介绍了倒装芯片技术和晶圆级封装制作工艺流程,叙述了凸点形成技术的两个常用技术—金属电镀技术和模板印刷技术,以及化学镀这种最常用的金属电镀技术,对更符合现代倒装芯片封装的凸点印刷工艺在理论和实践上作了探讨。

It introduces the inversion chips technology and Packaging procedures of Silicon Wafer.It emphases on the common technologies used for salient point forming,as metal electro plating,chemical electroplating and stencil printing.It also makes approaches on Salient point printing process on theory and practice.