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SOI-based radial-contour-mode micromechanical disk resonator

SOI-based radial-contour-mode micromechanical disk resonator
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摘要 This paper reports a radial-contour-mode micromechanical disk resonator for radio frequency applications. This disk resonator with a gold plated layer as the electrodes, was prepared on a silicon-on-insulator wafer, which is supported by an anchor on another silicon wafer through Au-Au thermo-compression bonding. The gap between the disk and the surrounding gold electrodes is 100 nm. The radius of the disk is 20μm and the thickness is 4.5 μm. In results, the resonator shows a resonant frequency of 143 MHz and a quality factor of 5600 in vacuum This paper reports a radial-contour-mode micromechanical disk resonator for radio frequency applications. This disk resonator with a gold plated layer as the electrodes, was prepared on a silicon-on-insulator wafer, which is supported by an anchor on another silicon wafer through Au-Au thermo-compression bonding. The gap between the disk and the surrounding gold electrodes is 100 nm. The radius of the disk is 20μm and the thickness is 4.5 μm. In results, the resonator shows a resonant frequency of 143 MHz and a quality factor of 5600 in vacuum
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2011年第11期72-76,共5页 半导体学报(英文版)
关键词 RF-MEMS micromechanical disk resonator SOI thermo-compression bonding RF-MEMS micromechanical disk resonator SOI, thermo-compression bonding
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