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半导体级别故障预测与健康管理 被引量:3

Review of Prognostics and Health Management on the Semiconductor-Level
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摘要 随着集成电路特征尺寸按比例缩小,其可靠性问题越来越突出。为了避免因集成电路失效而发生灾难性后果,有必要对集成电路进行故障预测与健康管理。首先,介绍了故障预测与健康管理技术的发展概况;然后,阐述了实施半导体级别故障预测与健康管理的两个主要方法:预兆单元法和失效先兆监测推理法,并根据相关案例进行了分析;最后,指出了该技术面临的挑战。 With the feature size of ICs(integrated circuits)scaling down,their reliability problems become more and more severe.Implementation of PHM to ICs is to prevent catastrophes from occurring.In this paper,the development of PHM is introduced at first.Then two main methods of semiconductor-level PHM are illustrated with some cases.Finally,some challenges for the technology are presented.
出处 《电子产品可靠性与环境试验》 2011年第5期58-62,共5页 Electronic Product Reliability and Environmental Testing
关键词 故障预测与健康管理 半导体产品 预兆单元 失效先兆 PHM semiconductor prognostic cell precursor
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  • 1Mishra Satchidananda, PECHT chael. In-situ Sensors for Product Reliability Monitoring [J] . Proceedings. SPIE., 2002, 4755 : 10-19.
  • 2LV Yu-bing, ZHUANG Yiqi. A Time Dependent Dielectric Breakdown (TDDB) Prognostic Monitor [ C] //2006 8th International Conference on Solid-State and Integrated Circuit Technology, 2007 : 1174-1176.
  • 3Karsten Pickard. Multiple Failure Mode and Effects Analysis-An Approach to Risk Assessment of Multiple Failures with FMEA [C] //Proceedings of Annual Reliability and Maintainability Symposium, 2005, 2005: 457-462.
  • 4FRANK Born. Marginal Checking-A Technique to Detect Incipient Failures [J] . IEEE Proceedings of the National Aerospace and Electronics Conference, 1989, (4) : 1880-1886.
  • 5JOSEPH A. Reynick, Integrated Circuit Early Life Failure Detection by Monitoring Changes in Current Signatures: US, 6873171B2 [P] . 2005-3-29.
  • 6SMITH P A. CAMPBELL D V. A Practical Implementation of BICS for Safety-critical Applications [C] //Proceedings of IEEE International Workshop on Defect Based Testing, 2000: 51- 56.
  • 7PECHUH I. 1.5 Volts Iddq/Iddt Current Monitor, Canadian Conference on Electrical and Computer Engineering [J] . Proceedings of IEEE Canadian Conference on Electrical and Computer Engineering, 1999, (1) : 472- 476.
  • 8XUE Bin. Built-in Current Sensor for IDDQ Test [C] // Proceedings of 2004 IEEE International Workshop on Current and Defect Based Testing, 2004: 3-9.
  • 9PRADEEP LALL. Prognostics and Health Management of Electronic Packaging [J] . IEEE Transactions on Components and Packaging Technologies, 2006, 29 (3) : 666-677.
  • 10RAMAKRISHNAN Arun, PECHT Michael G. A Life Consumption Monitoring Methodology for Electronic Systems [J] . IEEE Transactions on Components and Packaging Technologies, 2003, 26 (3): 625-634.

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