摘要
陶瓷基板材料对现代电子工业的发展起着重要作用。BeO 比最初使用的Al_2O_2的导热性高10倍。目前的发展使用 A1N 及 SiC 等。研究 A1N 的一般烧结技术及技术的发展。例如使用少量的烧结促进剂以及除 Y_2O_3烧结促进剂以外而使用 YF_3。研究了 SiC 的烧结技术、原理及材料特性。高导热性陶瓷的技术发展主要是可机械加工的 A1N-BN 复合陶瓷及低温烧结复合陶瓷。最后叙述了各种应用.
The ceramic substrate plays an impor- tant role in the development of modern electronic industry.The conventional te- chnology and its development of AlN used for ceramic substrate have been described. The sintering technology and materials characteristis of SiC,machinable AlN-BN composite ceramics and the composite cera- mics sintered in low temperature condition were presented.Finally,the various ap- plications of ceramics mentioned above are described.
出处
《仪表材料》
CSCD
1990年第6期380-385,370,共6页