摘要
介绍了目前电子器件功率增长的状况,提出了CAE在电子系统热设计中的应用趋势,介绍了ICEPAK的求解原理,并结合一个实际例子,说明了求解分析过程。最后通过算例验证了CAE方法在设计中的作用。
It introduces a brief status about the growth of electronic components＇ power, analyzes the developing trend and application of CAE on thermal design of electronic system, presents the solution priciple of I- CEPAK and shows an example procedure by a case. This demonstrates the advantages of CAE in the thermal design of electronic devices.
