摘要
随着电子技术的飞速发展,大功率、高功率密度器件被广泛研制和应用,而如何对这些高功率器件进行合理、有效的散热,以提高其可靠性,却是一个难题。文中主要探讨了电子设备的冷却散热问题,介绍了冷却系统的设计原则以及冷却方式和冷却介质的选择,同时对常用的风冷系统、液冷系统的设计及设计时需要注意的问题进行了详细的分析,最后介绍了仿真、试验在电子设备热设计中的应用,对一些新型导热材料的应用进行了展望。
With the rapid development of electronic technology,superpower and high power density devices are widely developed and applied.But there is a problem about how to cool these superpower devices reasonably and effectively to improve their reliability.The cooling technique for the electronic equipment is mainly di-scussed in this paper.First,the design principle of the cooling system and the selection of the cooling mode and the coolant are introduced.Then a detailed description on the design of the air-cooling system and the li-quid-cooling system commonly used is given.And the problems in the design are analyzed in detail.Finally,the application of the simulation,experiment on the thermal design of the electronic equipment is introduced in this paper.And the application of some new thermal conductive materials is prospected at the end of the paper.
出处
《电子机械工程》
2011年第5期8-11,共4页
Electro-Mechanical Engineering
关键词
电子设备
冷却
热设计
electronic equipment
cooling
thermal design
