期刊文献+

无氰镀银溶液组成对镀层外观影响的研究 被引量:4

Effect of Cyanide Free Silver Plating Solution Composition on Coating Morphology
下载PDF
导出
摘要 为了解决氰化物镀银溶液给环境带来的污染,采用5,5-二甲基乙内酰脲和焦磷酸钾为配位剂,研究了低污染无氰镀银溶液的组成。考察了硝酸银、5,5-二甲基乙内酰脲、碳酸钾、焦磷酸钾、添加剂的含量及pH对镀银层外观质量的影响;采用场发射扫描电子显微镜观察镀银层的微观形貌。实验结果表明,采用低污染无氰镀银溶液可获得光亮细致的镀银层,镀银溶液对环境污染小,其废水处理容易,具有工业应用推广的价值。 In order to eliminate the pollution of cyanide silver plating solution to the environment,the composition of alow polluted and cyanide free silver plating solution with 5,5-dimethylhydantoin(DMH) and potassium pyrophosphate as complex forming agent was studied.The surface morphology of silver coating was evaluated under different concentration of AgNO3,DMH,K2CO3,potassium pyrophosphate,additive and pH value.The results indicated that bright and fine silver coatings could be obtained in low polluted and cyanide free silver plating solution.And this low polluted and cyanide free silver plating solution has a potential application in electroplating industry because of low pollution to the environment and easy disposing of waste water.
出处 《电镀与精饰》 CAS 北大核心 2011年第11期33-35,共3页 Plating & Finishing
基金 哈尔滨市科技攻关项目资助(2005AA5CG156)
关键词 无氰镀银 5 5-二甲基乙内酰脲 焦磷酸钾 低污染 cyanide free silver plating 5 5-dimethylhydantoin potassium pyrophosphate low pollution
  • 相关文献

参考文献12

  • 1张庆,成旦红,郭国才,郭长春,曹铁华.无氰镀银技术发展及研究现状[J].电镀与精饰,2007,29(5):12-16. 被引量:23
  • 2周永璋,丁毅,陈步荣.丁二酰亚胺无氰镀银工艺[J].表面技术,2003,32(4):51-52. 被引量:22
  • 3陈惠国.论电镀废水治理技术发展动态[J].电镀与环保,2001,21(3):32-35. 被引量:26
  • 4刘奎仁,吕久吉,谢锋.亚硫酸盐无氰镀银工艺[J].沈阳黄金学院学报,1997,16(4):258-263. 被引量:17
  • 5杨秀汉.对亚氨基二磺酸铵无氰镀银的工艺探讨[J]电镀与环保,1985(01).
  • 6张瑜.咪唑-磺基水杨酸镀银[J]防腐包装,1982(04).
  • 7Jayakrishnan S,Natarajan S R.Alkaline NoncyanideBath for Electrodeposition of Silver. Metal Finishing . 1996
  • 8Simons W,Gonnissen D,Hubin A.Study of the Initial Stages ofSilver Electrocrystallization from Silver Thiosuphate Complexes. JElectroanal Chem . 1997
  • 9Vandeputte S,Verboom E,Hubin A.Influence of the Sodium NitrateContent on the Rate of the Electrodeposition of Silver fromThiosulphate Solutions. Electrochimica Acta . 1997
  • 10Vandeputte S,Verboom E,Hubin A.Investigation of the Mechanismof Silver Deposition from Thiosulphate Solutions by Means of ACImpedance Measurements and Surface-enhanced Raman Spectroscopy. Electrochimica Acta . 1996

二级参考文献46

共引文献66

同被引文献63

引证文献4

二级引证文献14

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部