贴片及引脚式LED芯片连接的热应力应变对比分析

Contrastive Analysis of Thermal Stress-strain of Surface-mount and Swaged-lead Modes for LED Package

高功率LED的高温是产生应力的根源。采用有限元方法对2种LED芯片连接方式进行模拟,获得2种LED封装下的温度分布及应变分布。研究表明,贴片式连接的应变数值小于引脚式连接应变数值,同时贴片式连接产生的应变释放空间更大,说明在相同的装配工艺下贴片式封装的可靠性更高。

his paper introduces the coupling of LED's thermal-structure interaction.The general heat transfer mode and the solid stress-strain mode are applied in the course of simulation;the finite element method is used to scope the calculation,the temperature profile and strain profile of the structures of the LED are obtained.Finally,this paper finds out that the surface-mount mode is better than the swaged-lead mode for LED package.