有机多膦酸的电抛光性能及电抛光粘液膜的组成

ELECTROPOLISHING BEHAVIOR OF ORGANOPHOSPHONIC ACID AND CQMPOSITION OF VISCOUS FILM ON ELECTROPOLISHED COPPER SURFACE

对5种有机多膦酸的电抛光效果研究表明,1-羟基乙叉-1,1-二膦酸,(HEDP),1-己膦基乙叉-1,1-二膦酸(EEDP)和N,N’-二甲叉膦酸甘氨酸(DMPG)可用于铜和铜合金的电抛光,其中HEDP的效果最好。在不同pH和不同成分(H_3PO_4.HEDP和H_3PO_4+HEDP)的电抛光液中在铜表面均观察到粘液膜的形成,它易用水洗去。XPS’_n检测表明,电抛光铜的表面无磷存在。 由H_3PO_4+HEDP电抛光液得到的粘液膜具有很好的成膜性能,从-Ar^+溅射剥蚀曲线的恒定组成区求得固化粘液膜的组成与多核聚合配合物〔Cu_4(PO)_4(HEDP)〕_n接近。

The electropolishing behavior of tive organopolyphosphonic acids has been studied. Theresults showed that 1-hydroxyethylidene-1,1-diphosphonic acid(HEDP), 1-ethylphosphono-ethylidene-1, 1-diphosphonic acid(EEDP) and N, N′-dimethylidene-phosphonoglycine(DMPG)can be used for electropolishing copper and its allcy,and among them the HEDP gave thebest result.Viscous liquid film was observed in all conditions used, such as HEDP concen-trations,pH of solutions and kind of electropolishing solution (H_3PO_4,HEDP, and H_3PO_4+HEDP). Detection of phosphorus in electropolished copper surface was made by XPS and Augerline.No phosphorus was found. The viscous liquid film obtained from H_3PO_4+HEDP solution possesses very goodfilm-forming characteristics., The composition of the viscous film can be established fromthe constant composition region of the depth profile curve and may be considered to be apolynuclear coordination polymeric compound [Cu_4(PO-4)(HEDP)-n]