聚合物微流控芯片超声波微熔融键合方法

Ultrasonic Micro-Melting Bonding Method of Polymer Microfluidic Chips

为了将超声波聚合物焊接技术更好地应用于聚合物微流控芯片的键合,提出基于界面微熔融的聚合物微流控芯片超声波键合方法.设计了适用于该方法的导能筋结构,在合理的键合工艺参数控制下使导能筋结构材料不发生熔融流延,通过键合界面软化润湿来实现对微流控芯片微通道的密封连接.实验结果表明,键合时间仅为0.09 s,键合后微通道的承压能力可达6个大气压,满足微流控芯片的使用要求.面接触导能筋可采用机械加工或注塑方法获得,具有良好的产业化应用前景.

In order to better apply ultrasonic polymer welding technology to the bonding of polymer microfluidic chips,a surface micro-melting ultrasonic bonding method was proposed.The area contact energy director for the proposed method was designed and with reasonable control of the bonding parameters,the melting material of the area contact energy director did not flow in the bonding process.The interface of the two polymer substrates was softened and moistened by ultrasonic energy,so that the microchannel of the microfluidic chips was sealed and bonded.Experimental results show that it takes only 0.09 s to achieve the whole ultrasonic bonding and the resistance of the microchannel to pressure reaches 6 atmospheres,which meets the requirement for microfluidic chips＇ application.The area contact energy directors can be made by machining or injection molding,showing a good prospect of industrialization of microfluidic chips.