摘要
对内部无缺陷的单晶硅的纳米切削过程进行了分子动力学模拟．通过模拟结果，对单晶硅纳米切削中的切屑形成过程和加工表面的形成过程做出了合理的解释．并用第一原理应力计算方法对单晶硅纳米切削过程中的脆塑转变的可行性进行了研究．
In this paper,molecular dynamics simulation is carried on the nanometric culling of defect-free monocrystalline silicon. Based on simulations, a reasonable explanation is given to the forming mechanism of chip and surface machined in the cutting process of monocrystalline silicon. Moreover, the feasibility of brittle-ductile transition of monocrystalline Silion is studied with the method of first principle stress.
出处
《航空精密制造技术》
2000年第3期21-24,共4页
Aviation Precision Manufacturing Technology
基金
国家自然科学基金!59835180
关键词
纳米切削
分子动力学模拟
加工机理
脆塑转变
nanometric cutting
molecular dynamics simulation
machining mechanism
brittle-ductile transition
