单晶硅脆性材料塑性域超精密磨削加工的研究

Study on Ultra-precision Grinding of Single Silicon Brittle Material in the Ductile Mode

对单晶硅脆性材料的超精密磨削加工作了大量的实验研究。研究结果表明，对于单晶硅等脆性材料，其表面粗糙度主要与砂轮的平均磨粒尺寸、进给量等因素有关。当采用超精密磨床并在Ｖ_ｓ＝１２００ｍ／ｍｉｎ、 ｆ＝０～ ５００μｍ／ｒｅｖ、 ａ_ｐ＝０.１～ １０μμｍ的磨削条件下磨削时，只有当金刚石砂轮的平均磨粒尺寸低于２０μｍ，才能在塑性磨削模式下加工出高质量的光滑表面，其磨削后的表面粗糙度为ｒｍｓ：５．１４ｎｍ、 Ｒａ：３．２５ｎｍ。

In tabs paper, the experimental investigation is made on the grinding of single brittle materials. It is shown that the surface roughness is mainly related with the average grain size and feed per wheel revolution for the brittle materials such as single silicon. In the case of V_s = 1200m/min, f=0-500μm /rev, a_p= 0. 1-10μm,only when the average grain size of the diamond wheel is less than 20μm,the smooth high quality surface with the roughness of rms=5.14nm, Ra=3.25nm can be obtained under the condition of grinding in the ductile mode.