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Wavelet analysis of ultrasonic A-scan signal of solid-state welded joints 被引量:4

Wavelet analysis of ultrasonic A scan signal of solid state welded joints
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摘要 In the ultrasonic nondestructive evaluation of the quality of solid state welded joints, such as friction bonding and diffusion bonding, the main difficulty is the identification of micro defects which are most likely to emerge in the welding process. The ultrasonic echo on the screen of a commercial ultrasonic detector due to a micro defect is so weak that it is completely masked by noise, and impossible to be pointed out. In the present paper, wavelet analysis (WA) is utilized to process A scan ultrasonic signals from weak bonding defects in friction bonding joints and porosity in diffusion bonding joints. First, perception of WA for engineers is given, which demonstrates the physical mechanism of WA when applied to signal processing. From this point of view, WA can be understood easily and more thoroughly. Then the signals from welding joints are decomposed into a time scale plane by means of WA. We notice that noise and the signal echo attributed to the micro defect occupy different scales, which make it possible to enhance the signal to noise ratio of the signals by proper selection and threshold processing of the time scale components of the signals, followed by reconstruction of the processed components. In the ultrasonic nondestructive evaluation of the quality of solid state welded joints, such as friction bonding and diffusion bonding, the main difficulty is the identification of micro defects which are most likely to emerge in the welding process. The ultrasonic echo on the screen of a commercial ultrasonic detector due to a micro defect is so weak that it is completely masked by noise, and impossible to be pointed out. In the present paper, wavelet analysis (WA) is utilized to process A scan ultrasonic signals from weak bonding defects in friction bonding joints and porosity in diffusion bonding joints. First, perception of WA for engineers is given, which demonstrates the physical mechanism of WA when applied to signal processing. From this point of view, WA can be understood easily and more thoroughly. Then the signals from welding joints are decomposed into a time scale plane by means of WA. We notice that noise and the signal echo attributed to the micro defect occupy different scales, which make it possible to enhance the signal to noise ratio of the signals by proper selection and threshold processing of the time scale components of the signals, followed by reconstruction of the processed components.
出处 《China Welding》 EI CAS 2000年第1期22-29,共8页 中国焊接(英文版)
基金 This work is financially supported by the Beijing Natural Science Foundation!(No.2 962 0 0 4 )
关键词 wavelet analysis solid state bonding nondestructive evaluation ultrasonic testing wavelet analysis, solid state bonding, nondestructive evaluation, ultrasonic testing
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