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Interface structure and formation mechanism of diffusion-bonded joints of TiAl-based alloy to titanium alloy 被引量:4

Interface structure and formation mechanism of diffusion-bonded joints of TiAl-based alloy to titanium alloy
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摘要 Vacuum diffusion bonding of a TiAl based alloy (TAD) to a titanium alloy (TC2) was carried out at 1 273 K for 15~120 min under a pressure of 25 MPa . The kinds of the reaction products and the interface structures of the joints were investigated by SEM, EPMA and XRD. Based on this, a formation mechanism of the interface structure was elucidated. Experimental and analytical results show that two reaction layers have formed during the diffusion bonding of TAD to TC2. One is Al rich α(Ti)layer adjacent to TC2,and the other is (Ti 3Al+TiAl)layer adjacent to TAD,thus the interface structure of the TAD/TC2 joints is TAD/(Ti 3Al+TiAl)/α(Ti)/TC2.This interface structure forms according to a three stage mechanism,namely(a)the occurrence of a single phase α(Ti)layer;(b)the occurrence of a duplex phase(Ti 3Al+TiAl)layer;and(c)the growth of the α(Ti)and (Ti 3Al+TiAl)layers. Vacuum diffusion bonding of a TiAl based alloy (TAD) to a titanium alloy (TC2) was carried out at 1 273 K for 15~120 min under a pressure of 25 MPa . The kinds of the reaction products and the interface structures of the joints were investigated by SEM, EPMA and XRD. Based on this, a formation mechanism of the interface structure was elucidated. Experimental and analytical results show that two reaction layers have formed during the diffusion bonding of TAD to TC2. One is Al rich α(Ti)layer adjacent to TC2,and the other is (Ti 3Al+TiAl)layer adjacent to TAD,thus the interface structure of the TAD/TC2 joints is TAD/(Ti 3Al+TiAl)/α(Ti)/TC2.This interface structure forms according to a three stage mechanism,namely(a)the occurrence of a single phase α(Ti)layer;(b)the occurrence of a duplex phase(Ti 3Al+TiAl)layer;and(c)the growth of the α(Ti)and (Ti 3Al+TiAl)layers.
出处 《China Welding》 EI CAS 2000年第2期36-40,共5页 中国焊接(英文版)
关键词 diffusion bonding interface structure formation mechanism TIAL based alloy titanium alloyH diffusion bonding,interface structure,formation mechanism,TiAl based alloy,titanium alloyH
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参考文献9

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同被引文献15

  • 1Wenbo HAN and Jiuhai ZHANG National Key Laboratory of Precision Hot Processing of Metals, School of Materials Science and Engineering, Harbin institute of Technology, Harbin 150001, China.Diffusion Bonding between TiAl Based Alloys and Steels[J].Journal of Materials Science & Technology,2001,17(1):191-192. 被引量:1
  • 2何鹏,冯吉才,钱乙余.Analysis of diffusion bond interface of TiAl base alloy with Ti, TC4 alloy and 40Cr steel[J].Journal of Harbin Institute of Technology(New Series),2000,7(2):78-81. 被引量:5
  • 3张利,李树杰.Ni-Nb粉末与SiC陶瓷界面润湿特性研究[J].武汉理工大学学报,2006,28(5):11-13. 被引量:2
  • 4王天国,邵刚勤,段兴龙,史晓亮,李勇.粉末冶金TiAl基合金及其力学性能的研究进展[J].钛工业进展,2006,23(4):1-4. 被引量:6
  • 5张利,李树杰,张坤.活性粉末Ni-Al与SiC陶瓷的界面润湿特性和润湿机理研究[J].粉末冶金技术,2006,24(3):163-165. 被引量:2
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