摘要
文章介绍了破坏性物理分析(DPA)内容,以及它在高可靠性半导体器件质量验证中的作用。通过大量的数据表明,DPA 能有效地评价半导体器件的批质量.
The paper describes the content of destructive physical analysis and application in the quality verification of high reliability semiconductor devices.large amount of statistical dats show that destructive physical analysis can effectively estimates the quality of Semiconductor Devices.
出处
《航天器环境工程》
1999年第2期52-57,共6页
Spacecraft Environment Engineering
关键词
破坏性物理分析
高可靠性
质量保证
失效分析
生产批
Destructive Physical Analysis
High reliability
Quality assurance
Failure analysis Product lot
