铝基碳化硅增强材料(Al/SiC)和低温共烧陶瓷(LTCC)的钎焊

Soldering of SiC particulate reinforced aluminum(Al/SiC) and low temperature co fired ceramic (LTCC) materials

铝基碳化硅增强材料 (Al/SiC)和低温共烧陶瓷 (LTCC)适合高性能微波电路的高密度组装 .对这两种材料进行焊接时 ,温度和气氛对基材的焊接性能影响很大 .铝基碳化硅增强材料的镀层在焊接温度时容易发生氧化 ,低温共烧陶瓷的厚膜导体在真空加热和高温还原性气体的条件下焊接性劣化 .采用金基钎料中温钎焊时 ,优质的焊料和合理的焊接工艺是获得优质焊缝的关键 .

SiC particulate reinforced aluminum(Al/SiC) and low temperature cofired ceramic(LTCC) material are very suitable for high performance microwave circuit packages. Solderability of two materials is greatly influenced by temperature and atmosphere. The plate layer of Al/SiC is easily oxidized when the material is atmosphere treatment. The film conductor′s solderability of LTCC will become weak when heated in vacuum or heated in reduced atmosphere. Proper soldering process and using high quality soldering material are the essential factor to gain good joint when middle temperature soldering where gold bases solder is used.