摘要
The microstructures and crack propagating characteristic of Si 3N 4 (μ)/SiC (n, w) composite ceramic were studied with AEM. The Si 3N 4 (μ)/SiC (n, w) composite ceramic consists of β Si 3N 4, β SiC, a small amount of α Si 3N 4 and α SiC, and amorphous phase. Most of Si 3N 4 grains were equiaxed crystal and also there were some bulky columnar ones. Most of SiC particles and SiC whiskers distributed at the Si 3N 4 grain boundaries and a few of smaller SiC particles in the Si 3N 4 grains. Most of amorphous structure was in the junction of several Si 3N 4 grains and thin amorphous layer was observed only at a few of Si 3N 4 boundaries. Failured cracks propagated mainly along the boundaries of the Si 3N 4 grains and partially passed through Si 3N 4 grains. The path of crack propagating might change, branching and twisting of the cracks might occur when the expanding crack meet the SiC particle and/or SiC whisker. Effect of the microstructure on strength and toughness of the composite ceramic was briefly discussed.
The microstructures and crack propagating characteristic of Si 3N 4 (μ)/SiC (n, w) composite ceramic were studied with AEM. The Si 3N 4 (μ)/SiC (n, w) composite ceramic consists of β Si 3N 4, β SiC, a small amount of α Si 3N 4 and α SiC, and amorphous phase. Most of Si 3N 4 grains were equiaxed crystal and also there were some bulky columnar ones. Most of SiC particles and SiC whiskers distributed at the Si 3N 4 grain boundaries and a few of smaller SiC particles in the Si 3N 4 grains. Most of amorphous structure was in the junction of several Si 3N 4 grains and thin amorphous layer was observed only at a few of Si 3N 4 boundaries. Failured cracks propagated mainly along the boundaries of the Si 3N 4 grains and partially passed through Si 3N 4 grains. The path of crack propagating might change, branching and twisting of the cracks might occur when the expanding crack meet the SiC particle and/or SiC whisker. Effect of the microstructure on strength and toughness of the composite ceramic was briefly discussed.
