含铋铅锡焊料的组织与性能

Structure and Properties of Pb-Sn Solder Contain Bi

借助常规力学性能、物理性能、金相组织等检测技术．通过对合铋铅锡焊料的研究，结果表明：微量铋的加入能够提高合金的强度、硬度和低温搭接强度，同时降低合金的塑性，而对金相组织无明显影响。

use of measurement technology of traditional mechanies properties.Physics properties.metallographic structure,after PbSn Solder Contain Bi is studied.Experimental results show that the strength of the alloy.hardness.strength of ocnnect is -improved after trace Bi element is mixxed,and the extendness is reduced,but there isn't distinct influence in metallogrphic structure.