Microstructure and deposition mechanism of electrodeposited Cu/liquid microcapsule composite

电沉积Cu/液体微胶囊复合镀层的微观结构及沉积机理(英文)

The nanostructured copper/microcapsule containing liquid core materials composite（copper/liquid microcapsules composite） was prepared using direct current（DC） electrodeposition method.The surface morphology and microstructure of composite were investigated by means of scanning electron microscopy（SEM）,transmission electron microscopy（TEM） and X-ray diffraction（XRD）.The results show that the microstructure of electrodeposited layer transformed from bulk crystal to nano structure because of the participation of microcapsules.The diameters of microcapsules and the copper grain sizes in the composite were 2？20 μm and 10？20 nm,respectively.In addition,the electrodeposition mechanism of composite in the deposition process followed electrochemistry theory,which was proved by the theoretical analysis result and the experiment results.Meanwhile,the co-deposition process model was presented.

采用直流电沉积法制备纳米结构的Cu/液体微胶囊复合镀层。借助扫描电子显微镜(SEM)、透射电子显微镜(TEM)和X射线衍射(XRD)分析和表征复合镀层的表面形貌和微观结构。结果表明:加入微胶囊使得复合镀层由粗晶结构转变为纳米晶结构,其中镀层中液体微胶囊及铜纳米晶的尺寸分别为2～20μm和10～20nm。此外,通过理论分析证实了铜与液体微胶囊的电沉积过程遵循电化学沉积机理,并提出了相应的电沉积过程模型。