摘要
In this paper, a novel interferometric method with a wide range of sensitivities, called holography quasi projection moire, is proposed. It combines the features of the variated double projection moire method and the holographic interferometry method. This technique is used to study the failure modes of microelectronic packaging modules.
In this paper, a novel interferometric method with a wide range of sensitivities, called holography quasi projection moire, is proposed. It combines the features of the variated double projection moire method and the holographic interferometry method. This technique is used to study the failure modes of microelectronic packaging modules.
基金
The project supported by the National Natural Science Foundation of China
