摘要
Two methods used to grow adherent coatings, roughening of the surface for mechanical interlocking and the use of chemically compatible interlayers having intermediate thermal expansion coefficients are analyzed numerically with the aid of phase diagram. Calculations indicate that more roughness and smaller periodicity of the substrate surface will increase the interfacial area and thus enhance the adherence strength of the coating. The phase diagram shows that an intermediate layer with a proper composition gradient from the substrate to the film will relax the thermal stress at the interface effectively.
Two methods used to grow adherent coatings, roughening of the surface for mechanical interlocking and the use of chemically compatible interlayers having intermediate thermal expansion coefficients are analyzed numerically with the aid of phase diagram. Calculations indicate that more roughness and smaller periodicity of the substrate surface will increase the interfacial area and thus enhance the adherence strength of the coating. The phase diagram shows that an intermediate layer with a proper composition gradient from the substrate to the film will relax the thermal stress at the interface effectively.
