摘要
论述ECAD的设计过程、设计俘获、放置与布线、线延迟、硅编译等主要问题。在ECAD的各个阶段都和仿真有密切关系,尤其是在可测性及用仿真进行测试方面。
The paper deals with problems of the ECAD as the design procces, the design capture, placement androuting, wiring delay and silicon compilation. It has demonstrated the close interrelation of the different stepsin the CEAD. especially in ralation to testability and the testing with simulation.
关键词
仿真
分区
正式规格语言
硅编译
Simulation
partitioning
formal specification longuage
silicon compilation
