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抛光力对光学玻璃表面抛光质量的影响 被引量:3

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摘要 分析与测量了抛光模与工件盘之间的抛光力,并对如何控制与测量进行了研究.研究结果表明,随着抛光模与工件之间接触压力的增大,面型精度及表面粗糙度将变差,并且工件盘上各点切向力的变化将会引起抛光去除量不相同,因而也会导致面型精度的下降. This paper deals with the analysis and measurement of applied foroes between polishing plate and work holder,and makes an investigation on how to control and measure the polishing force.It has been Shown that the profile accuracy and the surface roughness of polished workpiece will be poorer and poorer with the increasing of contact pressure between polishing plate and workpiece,and that the removal amount differences caused by the variations of tangtial forces on the work holder will lead to the decrease of profile accuracy.
出处 《航空精密制造技术》 1997年第2期1-4,共4页 Aviation Precision Manufacturing Technology
基金 国家自然科学基金
关键词 光学玻璃 抛光力 面型精度 表面粗糙度 optical glass polishing force profile accuracy surface roughness
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同被引文献29

  • 1宋红文,夏季,刘继光.模具型腔表面振动抛光新技术的研究[J].轻工机械,2005,23(3):85-87. 被引量:5
  • 2Heyvaert I, Van Hove M, Witvrouw A. Effect of oxide and W-CMP on the material properties and eleetromigration behaviour of layered aluminum metallisations [J]. Microelectronic Engineering, 2000, 50 (1-4): 291-299.
  • 3YONG-JIN SEO, WOO-SUN LEE. Effects of different oxidizers on the W-CMP performance [J]. Materials Science and Engineering B, 2005, 118 (1-4): 281-284.
  • 4Steigerwald J M, Murarka S P, Gutmann RJ. Chemical Mechanical Planarization of Microelectronic Materials [M]. New York: Wiley Interscience, 1997.
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  • 6SiddiquiJA, McconnellRD, MeyersAM. US PatentApplication, 20080149591 A1, June26, 2008.
  • 7Seo Y J, Kim J H, Lee W S. Chemical mechanical polishing and electrochemical characteristics of tungsten using mixed oxidizers with hydrogen peroxide and ferric nitrate [J]. Mater Lett, 2006, 60 (9-10) : 1192-1197.
  • 8Li Y. Microelectronic Applications of Chemical Mechanical Planarization [M]. New Jersey: JohnWiley & Sons, 2008.
  • 9Seo Y J, Kim N H, Lee W S. Electrochemical corrosion effects and chemical mechanical polishing characteristics of tungsten film using mixed oxidizers [J]. MicroelectronEng, 2006, 83 (3): 428-433.
  • 10Young-JaeKanga, YNagendraPrasada, In-KwonKim. Synthesis ofFe metal precipitated colloidal silica and its application to W chemical mechanical polishing (CMP) slurry [J]. Journal of Colloid and Interface Science 2010, 349 (1): 402-407.

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