摘要
实体型大功率风冷散热器的性能和前景胡桅林,周宜辉,熊明(清华大学工程力学系北京100084)关键词风冷散热器,散热器,电力电子1引言大功率电力电子器件内部功耗会使器件结温升高,严重影响器件性能。为此。通态电流一千安以上的器件,传统采用水冷散热;低于一...
It is expected to make more powerful heat sink to cool power electronics by air. Analysis has been done and the curves of thermoresistance and metal expense for per kW heat dissipated via size were gotten. It indicates that the size or capability of dissipating heat of the solidtype heat sink has a rational limit. Too large scale will cause economically unreasonable. The thermoresistance can be divided into interior conductive thermoresistance and exterior convective thermoresistance. The interior one of the solid type heat sink rapidly increases with increment of the size, when its fraction in total exceeds that of convective one, further increment of the size will lose its meaning. And it was expounded that to make hollow type heat sink could solve this difficulty and make it reality of using air instead of water to cool high power electronics.
出处
《工程热物理学报》
EI
CAS
CSCD
北大核心
1996年第S1期179-182,共4页
Journal of Engineering Thermophysics
基金
国家自然科学基金
关键词
风冷散热器
散热器
电力电子
air cooling heat sink, heat sink, power electronics