摘要
本文介绍了抗高过载电路的封装技术与封装材料,对抗高过载电路的封装工艺作了详尽的探讨。重点介绍了一种新型的封装材料—改性环氧树脂,并给出了它和其它封装材料在抗冲击实验中的性能指标比对情况。
The paper introduces the packaging technology and materials for the anti-high load circuit. It explores the packaging craftsmanship in details. It makes emphasises on a novel packaging matsrial - improved epoxy.and illustrates it's performance parameters comparing with the other packaging materials.
出处
《测试技术学报》
1996年第3期122-125,共4页
Journal of Test and Measurement Technology
关键词
存储测试
高过载
封装材料
Storage test Anti - high load Packaging material
