3Polakovic Frank, Piano Anthony M. Process for preparing the through hole walls of a printed wiring board for electroplating: USA, US P 4622108A [P]. 1986-11-11.
4Minten Karll, Pismennaya Galina. Printed wiring board having carbon black-coated through holes: USA, US P 4684560A [P]. 1987-08-04..
5Minten Karll, Pismennaya Galina. Liquid carbon black dispersion: USA, US P 4724005A [P]. 1988-02-09.
6Lee Hyunjung. Process for preparing a non- conductive substrate for electroplating: USA, US P 2005199504A1 [P]. 2005-09-15.
7Polakovic Frank, Piano Anthony M. Process for preparing the through hole walls of a printed wiring board for electroplating: USA, US P 4622108A [P]. 1986-11-11.
8Minten Karll, Pismennaya Galina. Printed wiring board having carbon black-coated through holes: USA, US P 4684560A [P]. 1987-08-04.
9Minten Karll, Pismennaya Galina. Liquid carbon black dispersion: USA, US P 4724005A [P]. 1988-02-09.
10Lee Hyunjung. Process for preparing a non- conductive substrate for electroplating: USA, US P 2005199504A1 [P]. 2005-09-15.
